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Development Trend of Lead Frame Copper Alloy Materials

Dec 14,2017

Development Trend of Lead Frame Copper Alloy Materials

Lead frame copper alloy is roughly divided into  Cu-Fe, Cu-Ni-Si, Cu-Cr, Cu-Ni-Sn (JK - 2 alloy), ternary, quaternary and other multi - element copper alloy ,which is able to get better performance than the traditional binary alloy, lower cost, Cu-Fe alloy grade most, with good mechanical strength, anti-stress relaxation properties and low creep, is a good lead Frame material. Due to the lead frame production and packaging applications, in addition to high strength, high thermal conductivity, the material also requires good brazing performance, process performance, etching performance, oxide film bonding properties. Materials to the high-strength, high conductivity, low cost direction, the addition of a small amount of copper in a variety of elements, without significantly reducing the conductivity principle, improve the alloy strength (so that the lead frame is not easy to deformation) and overall performance, tensile More than 600Mpa strength, electrical conductivity greater than 80% IACS material is the hot research and development. And requires the copper strip to the high surface, accurate plate, uniform performance, continuous thinning strip thickness, from 0.25mm to 0.15mm, 0.lmm gradually thinning, thinning and specialization

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